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A total of over 60 billion yuan! Summary of major compound semiconductor projects in the first quarter of 2021

Contracted projects

①5.6 billion! Xinguangtai’s third-generation semiconductor project signed Nanchang

February 7th, Nanchang County (Xiaolan Economic Development Zone) Double Innovation Carnival cum The signing ceremony of the”Three Requests and Three Times” investment promotion project was held at the County Convention and Exhibition Center. A total of 30 projects were signed in the event, with a contract amount of 63.5 billion yuan!

Among them, Xinguangtai’s third-generation semiconductor display chip with an investment of 5.6 billion yuan, and Changnan Digital Technology Innovation with an investment of 5 billion yuan The center signed a contract and settled down.

②3 billion! Comprehensive coverage of compound semiconductor epitaxy business

On February 20, Suzhou High-tech Zone will hold 2021 at the construction site of Suzhou Anjieli Electronic Technology Project Signing ceremony for the concentrated start of major projects in the spring of 2015, 105 projects with a total investment of 71.2 billion yuan were started and signed.

According to reports, the semiconductor R&D and production headquarters project in the contracted project, with a total investment of 3 billion, covers all aspects of compound semiconductor epitaxial business , Provide a full range of extended product foundry services.

③The 2 billion silicon carbide project landed in Changji, Xinjiang! With an annual output of 80,000 pieces

On February 20, Changji Hui Autonomous Prefecture held a “cloud signing” ceremony for the investment promotion project, and the signing ceremony was signed on the same day 16 Projects with a total investment of 9.34 billion yuan.

At the signing ceremony that day, the total investment in the silicon carbide single-wafer chip project of Jiangsu Lianyungang Liangjing New Material Technology Co., Ltd. The amount was 2 billion yuan, which was the largest investment project of the day.

④The annual production capacity can reach 600,000 pieces! Wingtech’s Shanghai 12-inch plant will start production in July next year

Wingtech’s wholly-owned subsidiary, Anshi Semiconductor, is located in Lingang, Shanghai. The 12-inch wafer fab broke ground in January this year and will be put into production in July 2022, with a production capacity of 400,000 wafers per year.

Starting project

①The groundbreaking ceremony of the third-generation Bronze Sword semiconductor industry base is held!

On the morning of January 18th, the groundbreaking ceremony of the”Bronze Sword Third Generation Semiconductor Industry Base” was held in Pingshan, Shenzhen. The project is a major project in Shenzhen in 2020, covering an area of ​​8073.79 square meters and a total construction area of ​​nearly 50,000 square meters. It is expected to be completed by the end of 2022.

The base will serve as the headquarters of Bronze Sword Technology Group, and will also build a third-generation semiconductor R&D center and car-level carbonization Silicon power device packaging line and Sino-Europe Innovation Center incubator, etc.

②Annual production of 50,000 pieces! Suzhou Navitas third-generation semiconductor industry base laid the foundation

On the morning of January 24, Suzhou Navitas held a groundbreaking ceremony for the headquarters building. The project covers an area of ​​over 14,000 square meters, with a total construction area of ​​over 34,000 square meters. After completion, the annual output of gallium nitride monocrystalline substrates and epitaxial wafers can reach 50,000.

③Changzhou branch of the National Engineering Center for Wide Band Gap Semiconductors will land in Wujin, Changzhou

On the morning of February 22nd , In 2021, the key projects in Wujin District will be started and the groundbreaking ceremony of the Changzhou Xinchuangtiandi project will be held in Wujin National High-tech Zone.

At the meeting, 55 projects were started intensively, with a planned total investment of 50.5 billion yuan and an annual planned investment of 13.77 billion yuan. After the project is completed, it will land in the Changzhou branch of the National Engineering Center for Wide Band Gap Semiconductors.

Investment and financing projects

① Leon Micro invested 500 million yuan to establish a subsidiary to promote microwave radio frequency projects

In January, Leon Micro invested 500 million yuan to establish a subsidiary, Haining Leon Dongxin Microelectronics Co., Ltd. Specially responsible for the promotion and implementation of microwave radio frequency integrated circuit chip projects.

The total investment of the project is about 4.3 billion yuan. After completion, it is expected to produce 360,000 6-inch gallium arsenide/gallium nitride microwave radio frequency integrated circuit chips. These include an annual output of 180,000 gallium arsenide HBT and pHEMT chips, an annual output of 120,000 vertical cavity surface emitting laser VCSEL chips, and an annual output of 60,000 gallium nitride HEMT chips. The project was implemented by Haining Company in phases within five years, including 180,000 pieces per year for the first phase and 180,000 pieces per year for the second phase.

②Wingtech invests in basic semiconductors, Get SiC tickets!

On January 4, Basic Semiconductor, a leader in the local third-generation semiconductor industry, announced that the company has completed hundreds of millions of yuan in Series B financing, led by Wingtech Technology Investment, Shenzhen Investment Control Capital, Minhe Capital, Yitang Changhou and other institutions followed in the investment, and the original shareholders joined forces to make additional investments.

③Shenzhen Ruishi Technology completed over 100 million yuan of A round of financing

On January 29, Shenzhen Ruishi Technology successfully completed over 100 million yuan This round of financing was led by Chuanggu Capital, followed by Haiheng Capital, Huiyou Capital, Yangzi Xinrui, Guohua Investment and Beijing Binaweier Technology Co., Ltd.
It is reported that the financing of Ruishi Technology will be mainly used for the research and development, capacity expansion and market development of VCSEL optical chip technology and related products.

④Tongguang Crystal, a third-generation semiconductor substrate company, completes Series C financing

In January, Hebei Tongguang Crystal Co., Ltd. announced the completion C round of financing, this round of financing was led by CPE, and the amount of financing was not disclosed.

After financing, Tongguang Crystal will promote the new 200,000-piece silicon carbide monocrystalline substrate production project in Laiyuan High-tech Zone, Baoding City. The core products are 6-inch conductive substrate sheet. Such substrates mainly serve downstream market areas with huge growth potential such as new energy vehicles, photovoltaic inverters, and electric charging piles.

⑤220 million! Nationstar Optoelectronics’ capital increase subsidiary Nationstar Semiconductor

In March, Nationstar Optoelectronics issued an announcement stating that the company intends to use its own funds of 220 million yuan to invest in Nationstar Semiconductor. Capital increase.

National Star Semiconductor’s main business is the R&D, production and sales of LED chips based on sapphire gallium nitride and silicon substrates. GaN-based products include blue and green display chips, digital chips, white light lighting chips, high-power flip chips for car lights, UVA violet chips, etc.

⑥250 million! Tianfu Energy acquires 4%of Tianke Heda

On March 11, Tianfu Energy announced that Tianfu Energy will acquire Tianke for 250 million yuan Heda owns 4.6335%of the equity. After the completion of this transaction, Tianfu Energy will hold 10.6570%of Tianke Heda’s shares, making Tianke Heda’s second largest shareholder; Tianfu Group will hold 13.6244%of Tianke Heda’s shares and remain Tianke Heda’s largest shareholder.

⑦1 billion! Gallium nitride company Zhongtu Technology hits the Sci-tech Innovation Board

In March, the Shanghai Stock Exchange accepted the application for listing on the Zhongtu Science and Technology Innovation Board, and this time it plans to raise 1.003 billion yuan yuan.

It is reported that Zhongtu Technology mainly invests in Mini/Micro LED patterned substrate industrialization projects, and the third-generation semiconductor substrate materials engineering research center construction project. According to China Graphics, with the promotion of Mini/Micro LED technology, the demand for patterned sapphire substrates will continue to increase.