Recently, Chizhou Huayu Electronic Technology Co., Ltd. (hereinafter referred to as”Chizhou Huayu Electronics”) announced the phase III project and Huayu electronic integrated circuit advanced packaging and testing base project to achieve the capping of the main structure. After the completion of the project, the main packaging products of Chizhou Huayu Electronics will be upgraded from the existing QFN, DFN, SOP, to and sot products to the most advanced and high-end sip, LGA and BGA packaging products.
Source:Chizhou Huayu Electronic Technology Co., Ltd
It is reported that Chizhou Huayu electronic integrated circuit advanced packaging test base is located in the east of Huayu phase II, No. 106, Fenghuang Avenue, Chizhou economic and Technological Development Zone, Anhui Province. The total investment of the project is 1 billion yuan. The construction was officially started on December 15, 2021, with a total construction area of 45000 square meters and a three-story building structure above the ground.
Huayu electronics said that in the next step, the project management team will scientifically arrange the construction period, strengthen the control of safety, quality and civilized construction, and complete the remaining construction tasks on schedule while ensuring safety and quality. Ensure the overall project delivery and achieve the goal of smooth operation in the first half of 2022. Huayu phase IV construction is also about to be put on the agenda.